Multilayer Circuit Package
Product Description
Material: Al-Si Alloys
Baienwei adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.
Product Info
| Minorder | 1 |
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Product Detail
Product Description
- Surface Mount Device
Selectable Silicon Aluminum(Si/Al) Alloys
- AlSi70(Si-30%Al controlled expansion alloy)
Advantages
- Low density;
- High thermal conductivity and excellent heat dissipation;
- Adopts precision etching,devices have small tolerance and high precision;
- Ease of manufacture,platability and weldability.
AlSi Alloys Performance Parameters
Content wt% | Density g/cm³ | CTE 25℃ ppm/℃ | Thermal Conductivity 25℃ W/mK | Tensile Strength MPa | Yield Strength MPa | Poisson’s Ratio | Elongation % | Elastic Modulus GPa |
Al-27%Si | 2.6 | 17 | 175 | 170 | 130 | 0.29 | 3.8 | 91 |
Al-42%Si | 2.55 | 13.5 | 143 | 200 | 187 | 0.29 | 1 | 105 |
Al-50%Si | 2.5 | 11.5 | 140 | 200 | 210 | 0.28 | <1 | 108 |
Si-40%Al | 2.46 | 9 | 125 | 181 | 181 | 0.27 | <1 | 121 |
Si-30%Al | 2.43 | 7.5 | 120 | 138 | 138 | 0.25 | <1 | 131 |
Si-20%Al | 2.40 | 6 | 110 | 125 | 125 | -- | -- | 132 |
| Content | Density g/cm³ | CTE ppm/℃ | Thermal Conductivity W/mK | Tensile Strength MPa | Yield Strength MPa | Poisson’s Ratio | Elongation % | Elastic Modulus GPa |
| BEW 6061 | 2.7 | 22.6 | 210 | 312 | 270 | 0.33 | 12.5 | 69 |
| BEW 4047 | 2.66 | 21.6 | 193 | 208 | 129 | 0.33 | 18 | 70 |